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The name AutoCAD is a portmanteau of the words AUTO and DRAW. The “Auto” stands for automatic, while the “DRAW” stands for Digital Raster Graphics, and references the fact that AutoCAD first supported graphics files saved as raw bitmap images. Since AutoCAD 2016, the “DRAW” also stands for Data-Driven Raster Engine.
AutoCAD was originally written in the BASIC programming language. After version 2.0, AutoCAD continued to use the AutoCAD Basic programming language.
The earliest versions of AutoCAD were often nicknamed the
“flawed monstrosity”, but AutoCAD has since become widely regarded as a stable and highly accurate CAD program.
AutoCAD is the current successor to a long line of CAD programs, many of which have the suffix CADD (stands for Computer Aided Design and Drafting). AutoCAD was initially released to be a replacement for its predecessor, AutoCAD LT, which was a multi-user version for personal computers running on IBM PC XT, or compatible. It can also be used for single-user desktop applications on all three platforms (Windows, Mac OS X and Linux). AutoCAD 2018, version 2018.1, was released in June 2018 and introduced support for Windows 10 with its Creators Update. It is a 32-bit application running on Windows 7 and above, or Windows Server 2008 and above. AutoCAD 2019, released in June 2019, was the first 32-bit release for Windows 7 since the release of version 2017.0.
The user interface (UI) of AutoCAD has changed dramatically with each subsequent release. The most significant changes have been made to the Ribbon design since version 2015.
AutoCAD is named after the AutoCAD Core Technology Group, and the acronym for that group is the same as the name of the program.
The first public version of AutoCAD was 1.0 in December 1982.
AutoCAD 1.0 was a DOS-only application running in 16-color mode. It supported the graphics mode of the IBM PC XT and compatible and could be used to produce vector graphics, raster graphics, or both in a single session.
A demo of AutoCAD was provided to Bill Gates as a Christmas gift for him in 1984.
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Although the history of AutoCAD Download With Full Crack goes back more than three decades, the full version history may be found only in the user manual. For a brief description of the evolution of CAD software, see History of CAD software.
CAD software was typically an industry leader in terms of features and speed. The introduction of Windows 3.0 in 1990 gave CAD software a graphical user interface (GUI) that would allow it to be more readily used by non-technical people. However, the introduction of object-oriented programming with the release of AutoCAD in 1987, and user-level scripting languages in the early 1990s, brought much power to CAD users. CAD software has now become almost entirely graphical, making it much easier to use.
CAD is used in a number of ways, including creating architectural drawings, mechanical and electrical schematics, 3D model data and technical drawings.
The original CAD software was created by Cadsoft Systems for the IBM PC.
August 1985 – Cadsoft Systems is founded by John Creighton and Don Blachford, who leave the company in 1989. Creighton is named president.
August 1985 – CADSoft releases “AutoCAD” (AutoDesk Inc., 1984) as AutoCAD 2.01 and supports the 80386 processor. It uses x86 assembly language and is written in assembly language with object-oriented programming principles.
June 1986 – Cadsoft Systems releases “AutoCAD LT” (AutoDesk Inc., 1985) as AutoCAD 1.01 and supports the 80286 processor. It is a subset of AutoCAD that is available on the Microsoft DOS platform.
1986 – February – Cadsoft Systems releases “AutoCAD Architecture” (AutoDesk Inc., 1987).
May 1987 – Cadsoft Systems releases “AutoCAD (64 bit)” (AutoDesk Inc., 1987).
May 1987 – Cadsoft Systems releases “AutoCAD Electrical” (AutoDesk Inc., 1987).
May 1987 – Cadsoft Systems releases “AutoCAD Mechanical” (AutoDesk Inc., 1987).
January 1988 – Cadsoft Systems releases “AutoCAD Civil 3D” (AutoDesk Inc., 1988).
1988 – April – Cadsoft Systems releases “AutoCAD Map” (AutoDesk Inc., 1988).
1988 – Cadsoft Systems releases “AutoCAD Graphics
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1. Field of the Invention
This invention relates to a method of manufacturing a semiconductor device. This invention particularly relates to a method of manufacturing a semiconductor device comprising a flash memory having a flash memory cell in which data is electrically erased or programmed by FN tunneling.
2. Description of the Related Art
Conventionally, flash memories have been used for a large capacity file memory, and recently flash memories are widely used for the memory of a portable electronic apparatus, such as a mobile phone and a notebook type personal computer. In recent years, flash memories have been used as an image data memory, for the purpose of miniaturizing, weight-lightening, and high-speed operation.
In flash memories, the programming operation is performed to write or erase data electrically in units of a plurality of memory cells at the same time by a bulk erasing method. This bulk erasing method causes a substrate to carry a large current to break up oxygen or water molecules adsorbed on the substrate surface into hydrogen or oxygen ions. This is called an ashing operation. The substrate is heated by a heater of the flash memory to make the oxygen or water molecules adsorbed on the substrate surface carried into hydrogen or oxygen ions. This is called an ashing step. The heating source is provided in the substrate to carry out the ashing operation. The heating source is provided in the substrate to heat the substrate to carry out the ashing operation.
In addition, there is a method of carrying out the programming and erasing operations by F-N tunneling. This is a so-called tunneling programming. In this tunneling programming method, a large electric field is applied to a thin oxide film to cause electrons to tunnel through the thin oxide film to thereby cause data to be written in a silicon substrate. This is called a Fowler-Nordheim (F-N) tunneling.
An exemplary method of manufacturing a flash memory cell using the F-N tunneling will be described with reference to FIGS. 1A to 1D. A plurality of gate insulating films 100 are first formed over a silicon substrate 200, as shown in FIG. 1A. Then, a floating gate 102 is formed over the silicon substrate 200 and a control gate 104 is formed
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OS: Windows Vista (SP2) / Windows 7 / Windows 8 (IE9) / Windows 10
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